Overview of PS5 Pro Enhancements
- The PS5 Pro adopts a liquid metal thermal interface between the chip and heatsink, enhancing heat transfer; however, concerns about leakage in vertically positioned consoles remain a significant reliability issue.
- A recent disassembly of the PS5 Pro indicates modifications to its heatsink design compared to the original PS5, likely intended to address potential liquid metal leakage.
A comprehensive analysis of the PlayStation 5 Pro suggests that this new iteration of Sony’s gaming console may have successfully rectified a notable design vulnerability found in the original PS5 model—a flaw that could potentially leave the unit completely inoperable. Although there have not been widespread reports of failures, Sony appears to have taken proactive steps to safeguard against this issue in the PS5 Pro.
With the PS5’s GPU capable of reaching high speeds of up to 2.23GHz, Sony opted for liquid metal over traditional thermal paste to enhance thermal conductivity between the chip and heatsink. The primary advantage of using liquid metal lies in its superior heat conduction properties. However, this comes with a significant downside: in the event of a leak, the liquid metal can cause a short circuit, potentially damaging the motherboard beyond repair. Early in 2023, concerns were raised about PS5s that were positioned vertically for extended periods, prompting unease among users.
Fortunately, it was clarified that the liquid metal issue primarily pertains to used consoles that had undergone previous disassembly for repairs. New or unopened PS5 units are at minimal risk of this problem. Nonetheless, it seems that Sony has taken additional precautions in the design of the PS5 Pro’s internal components to further reduce the likelihood of liquid metal spillage. A recent teardown comparison published by the YouTube channel How-FixIT revealed that the redesigned heatsink features surface ridges, which likely assist in evenly distributing the liquid metal across the chip.
PS5 Pro’s Enhanced Heatsink Design to Mitigate Liquid Metal Leakage
Experts believe that the unique surface ridges of the PS5 Pro’s heatsink minimize the likelihood of liquid metal accumulating at the chip’s base, thereby preserving the console’s thermal performance. In contrast, the heatsink of the PS5 Slim has a flat contact area, illustrating Sony’s active response to earlier concerns with the PS5 Pro’s design. Additionally, another notable improvement is the inclusion of a conveniently accessible bay for the PS5 Pro’s CMOS battery, allowing users to replace it easily in case of failure.
To date, reports of liquid metal leakage have not been widespread among PS5 users, and many have questioned the likelihood of such occurrences. Regardless, the modifications to the PS5 Pro’s heatsink illustrate Sony’s commitment to addressing potential hardware failures proactively. Both the PS5 and Xbox Series X showcase impressive engineering, and it is unlikely that either console will encounter infamous issues similar to the Xbox 360’s Red Ring of Death.
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